IM69D127
Infineon Technologies IM69D127 XENSIV™ MEMS Microphone
The Infineon IM69D127 XENSIV™ MEMS microphone is based on Infineon's sealed dual-membrane MEMS technology, which provides a high level of protection (IP57) at the microphone level. This high-performance MEMS microphone is housed in a small 3.6mmx2.5mm package, making it ideal for compact audio devices such as TWS earbuds.
Features
Very low self-noise/very high SNR (69dB)
Selectable power modes for battery-critical applications
Sealed Dual Membrane (SDM) technology, microphone-grade IP57 protection
Very low group delay (9µs)
Small package size (3.6mm x 2.5mm x 1mm)
Very tight part-to-part phase and sensitivity matching (±1dB)
Flat frequency response, low LFRO (low frequency roll-off): 40 Hz
Applications
TWS earbuds
ANC headphones
Laptops and tablets
Wearables
